GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET FORECAST 2017-2025

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GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET FORECAST 2017-2025

Global Semiconductor packaging materials market is anticipated to grow with 4.96% CAGR over the forecast period of 2017-2025. The base year considered for the study is 2016 and the estimated period is between 2017 and 2025. Several key factors that are responsible for the market growth include:

GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET FORECAST 2017-2025

Global Semiconductor Packaging Materials Market Segmented by Type of Materials (Organic Substrates, Lead Frames, Bonding Wires, Encapsulation Resins, Ceramic Packages, Die Attach Materials, Solder Balls, Other Materials ) & by Geography

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Global Semiconductor packaging materials market is anticipated to grow by 4.96% CAGR over the forecast period of 2017-2025. The base year considered for the study is 2016 and the estimated period is between 2017 and 2025. Several key factors that are responsible for the market growth include:

  • Rising demand for smart electronic devices
  • Growing automotive semiconductor market
  • Increasing usage of semiconductor IC’S in Internet of Things (IoT) field
  • Growing technological advancements in semiconductor technology
  • Heavy investments in new product development, R&D

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The demand for smart electronic devices in on a surge. Almost every Smart Electronic Device such as Smartphones, laptops, tablets & wearable’s are a major application of IC and semiconductors. As a result, hasty growth in the production and adoption of smart electronic devices is the primary factor that is driving the market of semiconductor packaging materials.

In 2016, the organic substrates segment was the major revenue contributor to the global market, capturing an overall 50% market share. Moreover, it is expected to be the fastest growing segment for the forecast period. Organic substrates are the base layers of individual semiconductor devices and IC’s (integrated chips) on which other layers are deposited to complete the circuit. The flexibility of organic substrates allows them to be used as interconnects. These materials are mainly used in area array packages such as the BGA (ball grid array) and PGA (pin grid array).

Though the semiconductor packaging materials market has numerous growth drivers, market growth is curtailed by certain challenges. Strict material specifications set down by packaging assemblers and testers, volatile foreign exchange market, semiconductor consumption high in a particular region as compared to others, and cyclic nature of semiconductor industry are several factors that are slowing down the market growth. Other major challenges in the market include a high dependency on semiconductor industry & high capital required for initial setup.

The global Semiconductor packaging materials market has been segmented on the basis of the type of material used in semiconductor packaging. It is further sub-segmented as follows:

By Type of Material:

  • Organic substrates
  • Lead frames
  • Bonding wires
  • Encapsulation resins
  • Ceramic packages
  • Die attach materials
  • Solder balls
  • Other materials

The report considers the revenue generated from the sales of different types of packaging based on the type of material, which can be broadly classified as either lead frame based or laminate substrate based. However, the report scope is limited to the revenue generated from the semiconductor packaging materials only; it does not consider the revenue generated from semiconductor packaging equipment.

On the basis of geography, global Semiconductor packaging materials market has been segmented in seven major geographies;

  • China
  • Taiwan
  • South Korea
  • Japan
  • United States
  • Europe
  • Rest of world

In 2016, China led the global semiconductor packaging materials market, accounting for a majority share of around 36% share of the overall market revenue, followed by Taiwan. Reduction in hostilities between China and Taiwan has helped the integration of the semiconductor fabrication and packaging industries of both the countries. China is one of the world’s largest regulated economies with booming manufacturing businesses. Availability of cheap labor, raw material, and favorable factors of production in the region means that international corporations can scale up their manufacturing operations in the country, which, in turn, is anticipated to propel the semiconductor packaging materials market growth.

Global Semiconductor packaging materials market is segmented on the basis of the type of materials used for packaging. This segment is further divided into Organic substrates, Lead frames Bonding wires, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls, and other materials. Additionally, Different Semiconductor packaging technologies, namely, Small Outline (SO) Packages, Grid array (GA) Packages, Flat No-Leads Packages, Quad flat packages (QFP), Dual In-Line Package (DIP) and other technologies, are also discussed in detail in this report.

The major companies operating in the Global Semiconductor Packaging Materials Market are-

  • Amkor Technology
  • DuPont
  • Henkel
  • Hitachi Chemical
  • Honeywell
  • And others

Company profiles of the prominent market players are discussed in detail. Most of the companies are looking for strategies such as merger & acquisition, partnership, contracts, agreements, new product launch, to gain a competitive edge over other companies. For instance, in July 2017, Henkel acquired Darex Packaging Technologies. With this acquisition, Henkel complements the Adhesive Technologies portfolio with a highly strategic business to further strengthen its position in the global packaging market. Also, in May 2017, Amkor Technology, Inc. completed the acquisition of NANIUM S.A. The acquisition of NANIUM is expected to strengthen Amkor’s position in the fast-growing market of wafer-level packaging for smartphones, tablets and other applications

Key findings of the Global Semiconductor Packaging Materials Market:

  • In 2016, Asia Pacific led the global semiconductor packaging materials market. The Asia Pacific market is fueled by Taiwan, China, Japan, South Korea, and other South-East Asian countries such Indonesia, Malaysia, Singapore, and the Philippines. These countries are major producers of semiconductors and are a hub for consumer electronics goods, automotive and telecommunications.
  • Lead-free semiconductor packaging is gaining more traction in the market.
  • Technological advancements in the semiconductor industry have given rise to different applications of the semiconductor packaging materials.
  • The growing popularity of the highly advanced redistributed chip packaging will enhance the growth of the market over the forecast period.
  • Due to various favorable chemical properties of gold over copper (such as high thermal and electrical conductivity), the adoption rate of gold in semiconductor packaging is increasing in the market.
  1. RESEARCH SCOPE
    • STUDY GOALS
    • SCOPE OF THE MARKET STUDY
    • WHO WILL FIND THIS REPORT USEFUL?
    • STUDY AND FORECASTING YEARS
  2. RESEARCH METHODOLOGY
    • SOURCES OF DATA
      • SECONDARY DATA
      • PRIMARY DATA
    • TOP-DOWN APPROACH
    • BOTTOM-UP APPROACH
    • DATA TRIANGULATION
  3. EXECUTIVE SUMMARY
    • MARKET SUMMARY
    • KEY FINDINGS
  4. MARKET DYNAMICS
    • MARKET DEFINITION AND SCOPE
    • MARKET DRIVERS
      • RISING DEMAND FOR SMART DEVICES
      • GROWING AUTOMOTIVE SEMICONDUCTOR MARKET
      • INCREASING USAGE OF SEMICONDUCTOR IC’S IN IOT FIELD
      • GROWING TECHNOLOGICAL ADVANCEMENTS IN SEMICONDUCTOR TECHNOLOGY
    • MARKET RESTRAINTS
      • STRICT MATERIAL SPECIFICATIONS SET DOWN BY PACKAGING ASSEMBLERS AND TESTERS
      • VOLATILE FOREIGN EXCHANGE MARKET
      • SEMICONDUCTOR CONSUMPTION HIGH IN A PARTICULAR REGION AS COMPARED TO OTHERS
      • CYCLIC NATURE OF SEMICONDUCTOR INDUSTRY
    • MARKET OPPORTUNITIES
      • SHIFTING FOCUS FROM COPPER TO GOLD AS BONDING WIRE MATERIAL
      • LEAD-FREE PACKAGING DEMAND ON A RISE
      • GROWING ADOPTION OF FLIP-CHIP PACKAGING SOLUTIONS
    • MARKET CHALLENGES
      • HIGH DEPENDENCY ON SEMICONDUCTOR INDUSTRY
      • HIGH CAPITAL REQUIRED FOR INITIAL SETUP
  1. SEMICONDUCTOR PACKAGING TECHNOLOGY
    • SMALL OUTLINE (SO) PACKAGES
    • GRID ARRAY (GA) PACKAGES
    • FLAT NO-LEADS PACKAGES
    • QUAD FLAT PACKAGES (QFP)
    • DUAL IN-LINE PACKAGE (DIP)
    • OTHER TECHNOLOGIES
  2. MARKET BY TYPE OF MATERIALS
    • ORGANIC SUBSTRATES
    • LEAD FRAMES
    • BONDING WIRES
    • ENCAPSULATION RESINS
    • CERAMIC PACKAGES
    • DIE ATTACH MATERIALS
    • SOLDER BALLS
    • OTHER MATERIALS
  3. KEY ANALYTICS
    • PORTER’S FIVE FORCE ANALYSIS
      • THREAT OF NEW ENTRANTS
      • THREAT OF SUBSTITUTE
      • BARGAINING POWER OF SUPPLIERS
      • BARGAINING POWER OF BUYERS
      • INTENSITY OF COMPETITIVE RIVALRY
    • OPPORTUNITY MATRIX
    • VALUE CHAIN ANALYSIS
  4. GEOGRAPHICAL ANALYSIS
    • CHINA
    • TAIWAN
    • SOUTH KOREA
    • JAPAN
    • UNITED STATES
    • EUROPE
    • REST OF WORLD
  5. COMPETITIVE LANDSCAPE
    • KEY COMPANY ANALYSIS
    • COMPANY PROFILES
      • AMKOR TECHNOLOGY
      • APPLIED MATERIALS
      • ASM PACIFIC TECHNOLOGY (ASMPT)
      • BASF SE
      • CARSEM, INC
      • DUPONT
      • HENKEL
      • EVERGREEN SEMICONDUCTOR MATERIALS
      • HITACHI CHEMICAL
      • HONEYWELL
      • JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
      • KYOCERA
      • LG INNOTEK
      • MITSUI HIGH-TEC INC.
      • PLATFORM SPECIALTY PRODUCTS CORPORATION
      • SUMITOMO CHEMICAL CO. LTD.
      • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
      • TANAKA HOLDINGS CO., LTD.
      • TOPPAN PRINTING
      • TORAY INDUSTRIES CORPORATION
      • XIAMEN YONGHONG ELECTRONICS

 

LIST OF TABLES

TABLE 1: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY GEOGRAPHY, 2017-2025 (IN $ BILLION)

TABLE 2: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY TYPE OF MATERIALS, 2017-2025 (IN $ BILLION)

TABLE 3: GLOBAL ORGANIC SUBSTRATES MARKET, BY REGION, 2017-2025 (IN $ BILLION)

TABLE 4: GLOBAL LEAD FRAMES MARKET, BY REGION, 2017-2025 (IN $ BILLION)

TABLE 5: GLOBAL BONDING WIRES MARKET, BY REGION, 2017-2025 (IN $ BILLION)

TABLE 6: GLOBAL ENCAPSULATION RESINS MARKET, BY REGION, 2017-2025 (IN $ BILLION)

TABLE 7: GLOBAL CERAMIC PACKAGES MARKET, BY REGION, 2017-2025 (IN $ BILLION)

TABLE 8: GLOBAL DIE ATTACH MATERIALS MARKET, BY REGION, 2017-2025 (IN $ BILLION)

TABLE 9: GLOBAL SOLDER BALLS MARKET, BY REGION, 2017-2025 (IN $ BILLION)

TABLE 10: GLOBAL OTHER MATERIALS MARKET, BY REGION, 2017-2025 (IN $ BILLION)

TABLE 11: OPPORTUNITY MATRIX OF SEMICONDUCTOR PACKAGING MATERIALS MARKET

TABLE 12: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY GEOGRAPHY, 2017-2025, (IN $ BILLION)

TABLE 13: COMPANIES PRODUCING SEMICONDUCTORS IN CHINA BASED ON WAFER SIZE

TABLE 14: CHINA-HEADQUARTERED COMPANIES SUPPLYING SEMICONDUCTOR PACKAGING MATERIALS

TABLE 15: TOP SUPPLIERS IN EACH SEGMENT IN JAPAN

 

LIST OF FIGURES

FIGURE 1: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY TYPE OF MATERIALS, 2016 & 2025 (IN $ BILLION)

FIGURE 2: NUMBER OF WORLDWIDE SMARTPHONE USERS, 2015-2020 (IN BILLION)

FIGURE 3: NUMBER OF TABLET USERS ACROSS THE WORLD, 2015-2020, (IN BILLIONS)

FIGURE 4: WEARABLE DEVICES MARKET ESTIMATES, 2014-2018 (IN $ BILLION)

FIGURE 5: GLOBAL AUTOMOTIVE SEMICONDUCTOR MARKET, 2017-2025 ($ MILLION)

FIGURE 6: FLUCTUATING EXCHANGE RATES BETWEEN USD AND THE JAPANESE YEN, 2012 TO 2016

FIGURE 7: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY ORGANIC SUBSTRATES, 2017-2025 (IN $ BILLION)

FIGURE 8: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY LEAD FRAMES, 2017-2025 (IN $ BILLION)

FIGURE 9: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY BONDING WIRES, 2017-2025 (IN $ BILLION)

FIGURE 10: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY ENCAPSULATION RESINS, 2017-2025 (IN $ BILLION)

FIGURE 11: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY CERAMIC PACKAGES, 2017-2025 (IN $ BILLION)

FIGURE 12: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY DIE ATTACH MATERIALS, 2017-2025 (IN $ BILLION)

FIGURE 13: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY SOLDER BALLS, 2017-2025 (IN $ BILLION)

FIGURE 14: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, BY OTHER MATERIALS, 2017-2025 (IN $ BILLION)

FIGURE 15: PORTER’S FIVE FORCE MODEL OF SEMICONDUCTOR PACKAGING MATERIALS MARKET

FIGURE 16: VALUE CHAIN OF SEMICONDUCTOR PACKAGING MATERIALS MARKET

FIGURE 17: GLOBAL SEMICONDUCTOR PACKAGING MATERIALS MARKET, GEOGRAPHICAL OUTLOOK, 2016 & 2025 (IN %)

FIGURE 18: CHINA SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)

FIGURE 19: TAIWAN SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)

FIGURE 20: SOUTH KOREA SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)

FIGURE 21: JAPAN SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)

FIGURE 22: UNITED STATES SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)

FIGURE 23: EUROPE SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)

FIGURE 24: REST OF WORLD SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2017-2025 (IN $ BILLION)

FIGURE 25: KEY PLAYERS IN THE SEMICONDUCTOR PACKAGING MATERIALS MARKET, 2016

  1. MARKET BY TYPE OF MATERIALS
    • ORGANIC SUBSTRATES
    • LEAD FRAMES
    • BONDING WIRES
    • ENCAPSULATION RESINS
    • CERAMIC PACKAGES
    • DIE ATTACH MATERIALS
    • SOLDER BALLS
    • OTHER MATERIALS
  2. GEOGRAPHICAL ANALYSIS
    • CHINA
    • TAIWAN
    • SOUTH KOREA
    • JAPAN
    • UNITED STATES
    • EUROPE
    • REST OF WORLD

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